Selayang Solder provides a wide range of soldering materials such as Solder Bar/Wire, Flux Cored Solder Wire, Solder Paste, Solder Ball, Solder Anodes, Solder Rods and others. We are amongst the pioneers in the solder industry to develop lead free solders for the conservation of the environment.
Lead Free Solder Products
Alloy Composition
| Alloy Series | Product Code | Alloy Composition | Melting Point (°C) | Bar | Solid Wire | Flux Cored | Cream | Patent No. |
| Sn-Ag-Cu | NP103 |
Sn-0.3Ag- 0.5Cu |
216 ~ 227 | O | O | O | O | |
|
NP110 |
Sn-1.0Ag-0.7Cu |
216 ~ 222 |
O | O | O | O | ||
|
NP300 |
Sn-3.5Ag-0.7Cu |
216 ~ 220 |
O | X | X | X | #1 | |
|
NP303 |
Sn-3.0Ag-0.5Cu |
216 ~ 221 |
O | O | O | O | #1 | |
|
SA0307 |
Sn-0.3Ag- 0.5Cu |
216 ~ 227 |
O | O | O | X | ||
|
Sn-Cu |
NP503 |
Sn-0.7Cu |
227 |
O | X | O | X | |
|
Sn-Ag-Cu-Bi |
NP207 |
Sn-2.8Ag-1.0Bi-0.5Cu |
217~ 215 |
O | O | X | X | #2 |
|
|
SA1015 |
Sn-1.1Ag-1.0Bi-0.5Cu |
217~ 226 |
O | X | X | X | #2 |
|
Sn-Zn |
NP601 |
Sn-57Bi-1Ag |
187 ~ 196 |
X | X | X | ||
|
Sn-Ag-Bi-In |
NP402 |
Sn-3.5Ag-0.5Bi-8In |
196 ~ 206 |
X | X | X | O | #3 |
#1 US PAT No 5527628 #2 US PAT No 4879096, CN PAT No 1299471 #3 JP PAT No 6361626
