Improved thermal shock resistance and shock resistance
Enables reflow at low temperature with good wettability and printability
Significant improved reliability of joint strength, compare to conventional solder with low melting point
Test for thermal shock resistace
Reliability is the same or more than Sn-3.0Ag-0.5Cu
Test for shock resistance
Improved shock resistance
Basic characteristics
General use
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Epoxy resin
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Less flux residue
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Compatible with Ni
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Halogen-free low silver
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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High strength
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Epoxy resin low melting point
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Low Ag
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Low Ag
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Low void
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For laser
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Hallogen Free
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Low melting point
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