Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Low melting point
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For laser
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Epoxy resin
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Epoxy resin low melting point
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Low Ag
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Non-Halogen solder paste with low melting point
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Low void
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Halogen free (compatible with normal temperature storage)
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High strength
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Halogen-free low silver
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General use
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Less flux residue
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Low Ag
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Hallogen Free
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Water-soluble
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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