Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Low void
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General use(compatible with normal temperature strage)
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Low melting point
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Water-soluble
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Non-Halogen solder paste with low melting point
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Hallogen Free
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For laser
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Epoxy resin
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Low Ag
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Less flux residue
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High strength
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Epoxy resin low melting point
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Low Ag
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General use
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Compatible with formic acid reflow
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