Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Low Ag
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Epoxy resin
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Water-soluble
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Low Ag
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Low void
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Low melting point
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For laser
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Less flux residue
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Hallogen Free
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High strength
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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General use
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General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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