Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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Less flux residue
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Epoxy resin low melting point
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General use
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Low melting point
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Compatible with formic acid reflow
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Hallogen Free
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Low Ag
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Water-soluble
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High strength
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Halogen-free low silver
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Low void
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For laser
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Halogen free (compatible with normal temperature storage)
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Low Ag
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