Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Water-soluble
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Low void
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Halogen-free low silver
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Epoxy resin
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Compatible with formic acid reflow
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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General use
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General use(compatible with normal temperature strage)
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For laser
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Low Ag
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High strength
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Low melting point
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Less flux residue
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Low Ag
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