Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Halogen-free low silver
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General use(compatible with normal temperature strage)
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Low Ag
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Low void
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Less flux residue
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Compatible with formic acid reflow
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For laser
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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General use
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Epoxy resin low melting point
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Low Ag
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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High strength
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Low melting point
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