Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Non-Halogen solder paste with low melting point
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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For laser
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Halogen-free low silver
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Low Ag
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Low void
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Hallogen Free
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General use
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Compatible with Ni
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Epoxy resin
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Low Ag
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High strength
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Epoxy resin low melting point
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Less flux residue
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Water-soluble
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