Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Hallogen Free
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General use
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Compatible with Ni
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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Epoxy resin
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Halogen-free low silver
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Low void
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Low Ag
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Less flux residue
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High strength
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For laser
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