Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin low melting point
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Less flux residue
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Epoxy resin
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Non-Halogen solder paste with low melting point
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Low Ag
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Low Ag
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Compatible with Ni
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Compatible with formic acid reflow
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Hallogen Free
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For laser
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Water-soluble
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Halogen-free low silver
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General use
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High strength
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Halogen free (compatible with normal temperature storage)
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Low void
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