Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin low melting point
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Halogen-free low silver
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Low Ag
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General use
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Compatible with formic acid reflow
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Water-soluble
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Low Ag
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General use(compatible with normal temperature strage)
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High strength
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For laser
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Low void
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Hallogen Free
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