Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Compatible with formic acid reflow
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Compatible with Ni
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Low void
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Low Ag
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Low Ag
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General use
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General use(compatible with normal temperature strage)
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For laser
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High strength
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Epoxy resin
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Halogen-free low silver
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Hallogen Free
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Epoxy resin low melting point
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