Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
High strength
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General use
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Halogen-free low silver
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Low Ag
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Halogen free (compatible with normal temperature storage)
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For laser
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Hallogen Free
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Low Ag
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Water-soluble
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Low void
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Less flux residue
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Compatible with Ni
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Compatible with formic acid reflow
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