Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin
Read MoreLow Ag
Read MoreLow Ag
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreHallogen Free
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreWater-soluble
Read MoreGeneral use
Read MoreFor laser
Read MoreCompatible with Ni
Read MoreEpoxy resin low melting point
Read MoreHigh strength
Read MoreCompatible with formic acid reflow
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow void
Read MoreHalogen-free low silver
Read MoreLess flux residue
Read MoreNon-Halogen solder paste with low melting point
Read More