Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin
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Low Ag
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Low Ag
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General use(compatible with normal temperature strage)
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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General use
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For laser
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Compatible with Ni
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Epoxy resin low melting point
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High strength
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Low void
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Halogen-free low silver
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Less flux residue
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Non-Halogen solder paste with low melting point
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