Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
General use
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General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Low void
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Hallogen Free
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High strength
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Epoxy resin low melting point
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Low Ag
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Water-soluble
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For laser
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Less flux residue
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Compatible with Ni
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Compatible with formic acid reflow
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Low Ag
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Epoxy resin
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