Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Water-soluble
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General use
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High strength
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Compatible with formic acid reflow
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Low void
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Epoxy resin
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Hallogen Free
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Low Ag
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Epoxy resin low melting point
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For laser
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Less flux residue
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Low Ag
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Halogen free (compatible with normal temperature storage)
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