Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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For laser
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Compatible with formic acid reflow
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High strength
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Low Ag
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Epoxy resin
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Halogen-free low silver
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General use
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Low Ag
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Non-Halogen solder paste with low melting point
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Low void
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