Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
High strength
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General use
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Compatible with formic acid reflow
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Halogen-free low silver
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Epoxy resin
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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For laser
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Low Ag
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Hallogen Free
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Low Ag
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Low void
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