Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin low melting point
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Compatible with formic acid reflow
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Epoxy resin
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Low void
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For laser
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Low Ag
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General use
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Non-Halogen solder paste with low melting point
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Low Ag
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Water-soluble
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Hallogen Free
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Less flux residue
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High strength
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General use(compatible with normal temperature strage)
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