Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
General use(compatible with normal temperature strage)
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Low Ag
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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For laser
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Low void
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Epoxy resin low melting point
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Epoxy resin
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High strength
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Hallogen Free
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Low Ag
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Compatible with Ni
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Compatible with formic acid reflow
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Halogen-free low silver
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General use
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Water-soluble
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