Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
General use(compatible with normal temperature strage)
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High strength
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General use
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Compatible with Ni
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Low Ag
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Low void
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Non-Halogen solder paste with low melting point
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Low Ag
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For laser
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Less flux residue
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Hallogen Free
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Compatible with formic acid reflow
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Halogen-free low silver
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