Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Compatible with formic acid reflow
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Epoxy resin
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Low Ag
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Epoxy resin low melting point
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Hallogen Free
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General use
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High strength
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Low void
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Water-soluble
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Halogen-free low silver
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Low Ag
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For laser
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Low melting point
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General use(compatible with normal temperature strage)
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