Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Compatible with formic acid reflow
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Epoxy resin low melting point
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Hallogen Free
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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High strength
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Low Ag
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Compatible with Ni
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Low melting point
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Non-Halogen solder paste with low melting point
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General use
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For laser
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Low void
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Low Ag
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Epoxy resin
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