Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
High strength
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Compatible with formic acid reflow
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Water-soluble
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Non-Halogen solder paste with low melting point
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Low melting point
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For laser
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General use(compatible with normal temperature strage)
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Low Ag
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Compatible with Ni
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Low Ag
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Epoxy resin low melting point
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General use
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Halogen-free low silver
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Low void
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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