Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Low Ag
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Non-Halogen solder paste with low melting point
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Low melting point
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Low void
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For laser
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Water-soluble
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General use(compatible with normal temperature strage)
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General use
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Epoxy resin
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High strength
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Low Ag
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Epoxy resin low melting point
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Halogen-free low silver
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