Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Halogen-free low silver
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Water-soluble
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Epoxy resin
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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For laser
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Compatible with formic acid reflow
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High strength
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Low Ag
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General use
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Low melting point
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Non-Halogen solder paste with low melting point
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Low Ag
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Low void
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