Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Compatible with Ni
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Halogen-free low silver
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Low Ag
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Epoxy resin low melting point
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Water-soluble
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General use
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Low melting point
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Compatible with formic acid reflow
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For laser
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Low Ag
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Non-Halogen solder paste with low melting point
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Low void
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Epoxy resin
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High strength
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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