Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Low Ag
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Compatible with Ni
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General use(compatible with normal temperature strage)
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Low melting point
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High strength
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Low Ag
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Halogen-free low silver
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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For laser
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Water-soluble
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Non-Halogen solder paste with low melting point
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General use
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Compatible with formic acid reflow
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Low void
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Epoxy resin
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