Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
For laser
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Low melting point
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Non-Halogen solder paste with low melting point
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Halogen-free low silver
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Compatible with Ni
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High strength
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Epoxy resin low melting point
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Epoxy resin
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Hallogen Free
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Low Ag
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General use
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Water-soluble
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Low void
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Low Ag
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Halogen free (compatible with normal temperature storage)
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