Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Compatible with formic acid reflow
Read More
Epoxy resin low melting point
Read More
Epoxy resin
Read More
Compatible with Ni
Read More
For laser
Read More
Low melting point
Read More
Water-soluble
Read More
Hallogen Free
Read More
Halogen-free low silver
Read More
Halogen free (compatible with normal temperature storage)
Read More
Low Ag
Read More
Low Ag
Read More
Halogen free (compatible with normal temperature storage)
Read More
Non-Halogen solder paste with low melting point
Read More
Less flux residue
Read More
General use
Read More
High strength
Read More
General use(compatible with normal temperature strage)
Read More