Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Hallogen Free
Read MoreEpoxy resin low melting point
Read MoreHalogen-free low silver
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreNon-Halogen solder paste with low melting point
Read MoreWater-soluble
Read MoreCompatible with formic acid reflow
Read MoreFor laser
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreGeneral use
Read MoreCompatible with Ni
Read MoreEpoxy resin
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreLow melting point
Read MoreLess flux residue
Read MoreLow Ag
Read MoreLow Ag
Read More