Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Epoxy resin low melting point
Read MoreFor laser
Read MoreWater-soluble
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLess flux residue
Read MoreLow Ag
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreCompatible with Ni
Read MoreHallogen Free
Read MoreLow Ag
Read MoreCompatible with formic acid reflow
Read MoreGeneral use
Read MoreEpoxy resin
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreNon-Halogen solder paste with low melting point
Read MoreHalogen-free low silver
Read MoreHigh strength
Read MoreLow melting point
Read More