Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Compatible with formic acid reflow
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Halogen-free low silver
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Less flux residue
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For laser
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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General use
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Low Ag
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Compatible with Ni
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Hallogen Free
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Non-Halogen solder paste with low melting point
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Low melting point
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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High strength
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Epoxy resin
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Low Ag
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Epoxy resin low melting point
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