Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Water-soluble
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For laser
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General use
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Low Ag
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Low void
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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High strength
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Epoxy resin
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Halogen-free low silver
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Compatible with Ni
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Compatible with formic acid reflow
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Less flux residue
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Low Ag
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General use(compatible with normal temperature strage)
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Low melting point
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