Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Low void
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Non-Halogen solder paste with low melting point
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Less flux residue
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General use(compatible with normal temperature strage)
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General use
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Halogen-free low silver
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Compatible with Ni
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High strength
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Hallogen Free
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Low melting point
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For laser
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Epoxy resin low melting point
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Water-soluble
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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