Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Water-soluble
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Less flux residue
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Compatible with formic acid reflow
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Epoxy resin low melting point
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Low Ag
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Low melting point
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Compatible with Ni
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For laser
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Epoxy resin
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Low void
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Low Ag
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General use
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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High strength
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