Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
General use
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Epoxy resin low melting point
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Low void
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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High strength
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Compatible with Ni
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Low Ag
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Compatible with formic acid reflow
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For laser
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Non-Halogen solder paste with low melting point
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Water-soluble
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Less flux residue
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Hallogen Free
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Halogen-free low silver
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Low Ag
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Low melting point
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