Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Low Ag
Read More
Compatible with formic acid reflow
Read More
High strength
Read More
Less flux residue
Read More
Halogen free (compatible with normal temperature storage)
Read More
For laser
Read More
Compatible with Ni
Read More
Epoxy resin low melting point
Read More
Hallogen Free
Read More
Water-soluble
Read More
Low void
Read More
Halogen-free low silver
Read More
General use
Read More
Halogen free (compatible with normal temperature storage)
Read More
Low Ag
Read More
Low melting point
Read More
Epoxy resin
Read More
General use(compatible with normal temperature strage)
Read More
Non-Halogen solder paste with low melting point
Read More