Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Low melting point
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Halogen-free low silver
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Epoxy resin low melting point
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Compatible with Ni
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Low void
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General use
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General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Compatible with formic acid reflow
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Hallogen Free
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Low Ag
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Water-soluble
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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High strength
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For laser
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