Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Compatible with Ni
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Low melting point
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Low Ag
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Less flux residue
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Water-soluble
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Non-Halogen solder paste with low melting point
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Low void
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Hallogen Free
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High strength
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General use
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For laser
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Epoxy resin
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