Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Epoxy resin low melting point
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Epoxy resin
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Low void
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Compatible with formic acid reflow
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Low melting point
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Halogen-free low silver
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General use
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For laser
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High strength
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Hallogen Free
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Low Ag
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Low Ag
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Water-soluble
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