Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Epoxy resin low melting point
Read MoreGeneral use
Read MoreLow Ag
Read MoreEpoxy resin
Read MoreWater-soluble
Read MoreLow void
Read MoreHallogen Free
Read MoreLow melting point
Read MoreFor laser
Read MoreCompatible with formic acid reflow
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreCompatible with Ni
Read MoreHalogen-free low silver
Read MoreHigh strength
Read MoreLow Ag
Read MoreLess flux residue
Read MoreNon-Halogen solder paste with low melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read More