Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Epoxy resin low melting point
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General use
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Low Ag
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Epoxy resin
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Water-soluble
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Low void
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Hallogen Free
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Low melting point
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For laser
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Halogen-free low silver
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High strength
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Low Ag
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Less flux residue
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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