Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Epoxy resin low melting point
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For laser
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High strength
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General use
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Low Ag
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Non-Halogen solder paste with low melting point
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Compatible with Ni
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Low Ag
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Low void
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Halogen free (compatible with normal temperature storage)
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Low melting point
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General use(compatible with normal temperature strage)
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Compatible with formic acid reflow
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Epoxy resin
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Halogen-free low silver
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Hallogen Free
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