Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Low Ag
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General use
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Low melting point
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Compatible with Ni
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Epoxy resin
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Less flux residue
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High strength
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For laser
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Low Ag
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Compatible with formic acid reflow
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Low void
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Hallogen Free
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Non-Halogen solder paste with low melting point
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Water-soluble
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