Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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General use
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Low melting point
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Compatible with Ni
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Low Ag
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Low Ag
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High strength
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Epoxy resin
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Compatible with formic acid reflow
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Low void
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Water-soluble
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For laser
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Hallogen Free
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Epoxy resin low melting point
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