Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability!
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Low Ag
Read MoreCompatible with formic acid reflow
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreWater-soluble
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreCompatible with Ni
Read MoreHalogen-free low silver
Read MoreHallogen Free
Read MoreLow Ag
Read MoreNon-Halogen solder paste with low melting point
Read MoreLess flux residue
Read MoreEpoxy resin low melting point
Read MoreLow melting point
Read MoreLow void
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreGeneral use
Read MoreFor laser
Read MoreEpoxy resin
Read More