Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Low Ag
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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High strength
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Compatible with Ni
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Halogen-free low silver
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Hallogen Free
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Low Ag
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Non-Halogen solder paste with low melting point
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Less flux residue
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Epoxy resin low melting point
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Low melting point
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Low void
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Halogen free (compatible with normal temperature storage)
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General use
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For laser
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Epoxy resin
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