Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Hallogen Free
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Water-soluble
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Compatible with Ni
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Non-Halogen solder paste with low melting point
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Halogen-free low silver
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High strength
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Epoxy resin
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General use(compatible with normal temperature strage)
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Less flux residue
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Low void
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Low melting point
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Epoxy resin low melting point
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General use
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For laser
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Low Ag
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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