Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Less flux residue
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Low void
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Water-soluble
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Low Ag
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Low melting point
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Halogen free (compatible with normal temperature storage)
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General use
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Epoxy resin
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High strength
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Compatible with Ni
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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Hallogen Free
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Halogen-free low silver
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For laser
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General use(compatible with normal temperature strage)
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Low Ag
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