Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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General use
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Halogen-free low silver
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Epoxy resin
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For laser
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Low Ag
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Low melting point
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Compatible with Ni
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Low Ag
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Low void
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High strength
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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General use(compatible with normal temperature strage)
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Less flux residue
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Water-soluble
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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