Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Low Ag
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Hallogen Free
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Low void
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General use(compatible with normal temperature strage)
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For laser
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Water-soluble
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Non-Halogen solder paste with low melting point
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High strength
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Low melting point
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Compatible with formic acid reflow
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Epoxy resin
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Less flux residue
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General use
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Epoxy resin low melting point
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