Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Less flux residue
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Water-soluble
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Hallogen Free
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For laser
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Low void
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Halogen free (compatible with normal temperature storage)
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High strength
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Epoxy resin
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Low melting point
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Low Ag
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Compatible with Ni
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Compatible with formic acid reflow
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General use
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Halogen-free low silver
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Low Ag
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Non-Halogen solder paste with low melting point
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