Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Halogen-free low silver
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General use
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High strength
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Low void
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Low Ag
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Epoxy resin
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Non-Halogen solder paste with low melting point
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Water-soluble
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Epoxy resin low melting point
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Low melting point
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For laser
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Less flux residue
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Low Ag
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Compatible with formic acid reflow
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