Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Epoxy resin
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Less flux residue
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Epoxy resin low melting point
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High strength
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Low Ag
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General use
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Low Ag
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Low void
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For laser
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Low melting point
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Hallogen Free
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Compatible with Ni
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Halogen-free low silver
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Non-Halogen solder paste with low melting point
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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