Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability!
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Epoxy resin
Read MoreLess flux residue
Read MoreCompatible with Ni
Read MoreLow void
Read MoreLow Ag
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreNon-Halogen solder paste with low melting point
Read MoreEpoxy resin low melting point
Read MoreFor laser
Read MoreHigh strength
Read MoreLow melting point
Read MoreWater-soluble
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow Ag
Read MoreHalogen-free low silver
Read MoreGeneral use
Read MoreHallogen Free
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreCompatible with formic acid reflow
Read More