Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
High strength
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Low void
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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For laser
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Epoxy resin
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Water-soluble
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Low Ag
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Compatible with Ni
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Low melting point
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Less flux residue
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Low Ag
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General use
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